Semiconductor assembly automation line
時間：2021-12-10 訪問量：1767
1) Scheme overview:
The equipment mainly completes semiconductor packaging devices such as DIP24 / 27, sop27 / dfn3, dfn5, etc. The welding wire base, ceramic substrate, lead frame and magnetic steel sheet are encapsulated in one piece by the robot and sent to the reflow furnace. After the components are encapsulated and fixed, the packaging effect is detected by CCD. After the six axis robot tears the magnetic steel sheet, it is placed in the stacking pile, and the welding wire base is sucked into the conveyor belt and transmitted to the front of the reflow furnace.
2) Advantages of the scheme:
1. Fast efficiency: 42s / board; Perfectly match the reflow beat and make full use of the equipment.
2. High precision, using robot and visual positioning, the accuracy can reach + - 0.03mm.
3. Automatically identify product types and automatically adjust relevant product parameters.
4. High safety, with safety protection door.
The equipment mainly completes semiconductor packaging devices such as DIP24 / 27, sop27 / dfn3, dfn5, etc. The welding wire base, ceramic substrate, lead frame and magnetic steel sheet are encapsulated in one piece by the robot and sent to the reflow furnace. After the components are encapsulated and fixed, the packaging effect is detected by CCD. After the six axis robot tears the magnetic steel sheet, it is placed in the stacking pile, and the welding wire base is sucked into the conveyor belt and transmitted to the front of the reflow furnace.
2) Advantages of the scheme:
1. Fast efficiency: 42s / board; Perfectly match the reflow beat and make full use of the equipment.
2. High precision, using robot and visual positioning, the accuracy can reach + - 0.03mm.
3. Automatically identify product types and automatically adjust relevant product parameters.
4. High safety, with safety protection door.